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 SUD50N03-10AP
New Product
Vishay Siliconix
N-Channel 30-V (D-S), 175_C, MOSFET PWM Optimized
PRODUCT SUMMARY
V(BR)DSS (V)
30
rDS(on) (W)
0.010 @ VGS = 10 V 0.014 @ VGS = 4.5 V
ID (A)a
20 18
D
TO-252
G Drain Connected to Tab G D S
Top View Order Number: SUD50N03-10AP S N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 175_C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipation Operating Junction and Storage Temperature Range TC = 25_C TA = 25_C TA = 25_C TA = 100_C
Symbol
VDS VGS ID IDM IS PD TJ, Tstg
Limit
30
"20 20 14
Unit
V
A 100 20 71b 8.3a -55 to 175 W _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta t v 10 sec RthJA Steady State Maximum Junction-to-Case Notes: a. Surface mounted on 1" x 1" FR4 Board, t v 10 sec. b. See SOA curve for voltage derating. Document Number: 71134 S-99628--Rev. A, 10-Jan-00 www.vishay.com S FaxBack 408-970-5600 Steady State RthJC 40 1.75 50 2.1
Symbol
Typical
15
Maximum
18
Unit
_C/W
2-1
SUD50N03-10AP
Vishay Siliconix
New Product
MOSFET SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter Static
Drain-Source Breakdown Voltage Gate Threshold Voltage Gate-Body Leakage V(BR)DSS VGS(th) IGSS VGS = 0 V, ID = 250 mA VDS = VGS, IDS = 250 mA VDS = 0 V, VGS = "20 V VDS = 30 V, VGS = 0 V Zero Gate Voltage Drain Current Z G Vl DiC IDSS VDS = 30 V, VGS = 0 V, TJ = 125_C VDS = 30 V, VGS = 0 V, TJ = 175_C On-State Drain Currenta ID(on) VDS = 5 V, VGS = 10 V VGS = 10 V, ID = 15 A Drain-Source On-State Resistancea DiS OS Ri rDS(on) VGS = 10 V, ID = 15 A, TJ = 125_C VGS = 10 V, ID = 15 A, TJ = 175_C VGS = 4.5 V, ID = 15 A Forward Transconductancea gfs VDS = 15 V, ID = 15 A 20 0.011 50 0.0075 0.010 0.016 0.019 0.014 S W
Symbol
Test Condition
Min
Typ
Max
Unit
30
V 1 2 "100 1 50 150 A mA A nA
Dynamicb
Input Capacitance Output Capacitance Reversen Transfer Capacitance Total Gate Chargec Gate-Source Chargec Gate-Drain Chargec Turn-On Delay Timec Rise Timec Turn-Off Delay Timec Fall Timec Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf VDD = 15 V, RL = 0.3 W , ID ] 20 A, VGEN = 10 V, RG = 2.5 W VDS = 15 V, VGS = 10 V, ID = 20 A V V VGS = 0 V, VDS = 25 V f = 1 MH V V, MHz 2710 500 250 55 10 9 16 90 33 20 30 135 ns 60 40 100 nC C 6000 pF F
Source-Drain Diode Ratings and Characteristics (TC = 25_C)b
Continuous Current Pulsed Current Forward Voltagea Reverse Recovery Time IS ISM VSD trr IF = 100 A, VGS = 0 V IF = 20 A, di/dt = 100 A/ms 1.2 55 20 A 100 1.5 100 V ns
Notes: a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature.
www.vishay.com S FaxBack 408-970-5600
2-2
Document Number: 71134 S-99628--Rev. A, 10-Jan-00
SUD50N03-10AP
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
200 VGS = 10 thru 6 V 5V 120 100
Vishay Siliconix
Transfer Characteristics
160 I D - Drain Current (A)
80 I D - Drain Current (A)
60
80
4V
40 TC = 125_C 20 25_C -55_C 0
40 3V 0 0 2 4 6 8 10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Transconductance
100 TC = -55_C g fs - Transconductance (S) 25_C 60 125_C 40 r DS(on) - On-Resistance ( W ) 80 0.030
On-Resistance vs. Drain Current
0.025
0.020
0.015
VGS = 4.5 V VGS = 10 V
0.010
20
0.005
0 0 10 20 30 40 50
0 0 20 40 60 80 100
ID - Drain Current (A)
ID - Drain Current (A)
Capacitance
5000 10
Gate Charge
4000 C - Capacitance (pF) Ciss 3000
V GS - Gate-to-Source Voltage (V)
8
VDS = 15 V ID = 50 A
6
2000
4
1000
Coss Crss 0 6 12 18 24 30
2
0
0 0 10 20 30 40 50
VDS - Drain-to-Source Voltage (V) Document Number: 71134 S-99628--Rev. A, 10-Jan-00
Qg - Total Gate Charge (nC) www.vishay.com S FaxBack 408-970-5600
2-3
SUD50N03-10AP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
2.0 VGS = 10 V ID = 50 A r DS(on) - On-Resistance (W) (Normalized) 1.6 I S - Source Current (A) TJ = 150_C TJ = 25_C 10 100
Source-Drain Diode Forward Voltage
1.2
0.8
0.4
0 -50
1 -25 0 25 50 75 100 125 150 175 0 0.3 0.6 0.9 1.2 1.5
TJ - Junction Temperature (_C)
VSD - Source-to-Drain Voltage (V)
THERMAL RATINGS
Maximum Avalanche Drain Current vs. Ambient Temperature
25 1000 Limited by rDS(on) 20 I D - Drain Current (A) I D - Drain Current (A) 100 10 ms 100 ms
Safe Operating Area
15
10
1 ms 10 ms 100 ms 1s
10
1
5
0.1
TA = 25_C Single Pulse
10 s 100 s dc
0 0 25 50 75 100 125 150 175
0.01 0.1 1 10 100
TA - Case Temperature (_C) 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
0.2
Notes:
0.1 0.1 0.05 0.02
PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 40_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
Single Pulse 0.01 10-4 10-3 10-2 10-1 1
10
100
600
Square Wave Pulse Duration (sec) www.vishay.com S FaxBack 408-970-5600 Document Number: 71134 S-99628--Rev. A, 10-Jan-00
2-4


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